An array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a tft area and a lead-wire area, the display area includes a data line and a gate line. The GOA circuit area is provided with at least one first via and at least one second via, a data-line metal layer is disposed at the bottom of the at least one first via, and a gate-line metal layer is disposed at the bottom of the at least one second via. The GOA circuit area further includes a first electrode and a second electrode, the data-line metal layer is electrically connected to one electrode through the at least one first via, the gate-line metal layer is electrically connected to the other electrode through the at least one second via, such that a capacitor is formed between the first electrode and the second electrode.
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1. A method for manufacturing an array substrate, the array substrate includes a gate driver on array (GOA) circuit area which includes a thin film transistor (tft) area for outputting a gate row-driving signal and a lead-wire area connected to the tft area, and a display area which includes a data line and a gate line which are arranged crosswise; wherein the GOA circuit area further includes a first electrode and a second electrode, the method comprising:
forming a resin layer having a first via on a substrate on which the tft area is formed such that the first via penetrates through the resin layer to expose a data-line metal layer of the tft area;
forming a first electrode on the surface of the resin layer such that the first electrode is electrically connected to the data-line metal layer through the first via;
forming a passivation layer having a second via on the substrate on which the first electrode is formed such that the second via penetrates through the passivation layer, the resin layer, and a gate-insulating layer of the tft area to expose a gate-line metal layer of the tft area; and
forming a second electrode on the surface of the passivation layer such that the second electrode is electrically connected to the gate-line metal layer through the second via, to form a capacitor between the first electrode and the second electrode.
2. The method according to
providing a first transparent electrode and a second transparent electrode in the display area such that the first transparent electrode and the first electrode are formed in the same layer by a single patterning process, and the second transparent electrode and the second electrode are formed in the same layer by a single patterning process.
3. The method according to
in the lead-wire area, further providing a third electrode integrally formed with the first electrode and a fourth electrode integrally formed with the second electrode such that a capacitor is formed between the third electrode and the fourth electrode.
4. The method according to
making the first electrode connected to a pixel electrode, and making the second electrode connected to a common electrode.
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This is a divisional application of U.S. patent application Ser. No. 14/139,834, filed Dec. 23, 2013, which is hereby incorporated by reference, which claims priority to Chinese Application No. 201210568716.2, filed Dec. 24, 2012.
The present invention relates to a field of display technology, in particular, relates to an array substrate, a method for manufacturing the same, and a display device.
In order to improve the display effect of a display device, more and more people start to pay attention to the design of a narrow frame for a display device. Especially for a spliced screen for large-screen outdoor display, a display device with a narrow frame can effectively reduce the width of a spliced gap in a spliced screen, thereby improving the overall display effect significantly.
In the prior art, manufacturing of a display with a narrow frame is generally realized by compressing a process margin to the limit, wherein a very important technology is a Gate Driver on Array (GOA) technology, which has achieved mass production. A gate switching circuit is integrated into an array substrate of a display panel by using the GOA technology, to form scan driving for the display panel, thus a gate driver integrated circuit may be omitted. This can not only reduce production cost in two aspects of material cost and manufacturing process, but also realize symmetry of two sides of a display panel and beautiful design of a narrow frame. The configuration of an existing display panel may be shown as in
An object of the present invention is to provide an array substrate, a method for manufacturing the same, and a display device, which do not need to specially provide a capacitor area in a GOA circuit area. Thus, the overall length of the GOA circuit area may be reduced, and the width of a frame of the display device is further reduced.
In order to achieve the above object, the following technical solutions are employed in the embodiments of the present invention:
An aspect of the embodiments of the present invention provides an array substrate. The array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area for outputting a gate row-driving signal and a lead-wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise;
The GOA circuit area is provided with at least one first via and at least one second via, a data-line metal layer is disposed at the bottom of the at least one first via, and a gate-line metal layer is disposed at the bottom of the at least one second via;
The GOA circuit area further includes a first electrode and a second electrode, the data-line metal layer is electrically connected to one electrode of the first electrode and the second electrode through the at least one first via, and the gate-line metal layer is electrically connected to the other electrode of the first electrode and the second electrode through the at least one second via, such that a capacitor is formed between the first electrode and the second electrode.
Another aspect of the embodiments of the present invention provides a display device, and the display device includes the array substrate as described above.
Yet another aspect of the embodiments of the present invention provides a method for manufacturing an array substrate, the array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area for outputting a gate row-driving signal and a lead wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise; wherein the GOA circuit area further includes a first electrode and a second electrode, the method including:
Forming a resin layer having a first via on a substrate on which the TFT area is formed such that the first via penetrates through the resin layer to expose a data line metal layer of the TFT area;
Forming a first electrode on the surface of the resin layer such that the first electrode is electrically connected to the data line metal layer through the first via;
Forming a passivation layer having a second via on the substrate on which the first electrode is formed such that the second via penetrates through the passivation layer, the resin layer, and a gate-insulating layer of the TFT area to expose a gate-line metal layer of the TFT area; and
Forming a second electrode on the surface of the passivation layer such that the second electrode is electrically connected to the gate-line metal layer through the second via to form a capacitor between the first electrode and the second electrode.
Still another aspect of the embodiments of the present invention provides a method for manufacturing an array substrate, the array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area for outputting a gate row-driving signal and a lead-wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise; wherein the GOA circuit area further includes a first electrode and a second electrode, the method including:
Forming a resin layer having a second via on a substrate on which the TFT area is formed such that the second via penetrates through the resin layer and a gate-insulating layer of the TFT area to expose a gate-line metal layer of the TFT area;
Forming a first electrode on the surface of the resin layer such that the first electrode is electrically connected to the gate-line metal layer through the second via;
Forming a passivation layer having a first via on the substrate on which the first electrode is formed such that the first via penetrates through the passivation layer and the resin layer to expose a data-line metal layer of the TFT area; and
Forming a second electrode on the surface of the passivation layer such that the second electrode is electrically connected to the data-line metal layer through the first via to form a capacitor between the first electrode and the second electrode.
The array substrate, the method for manufacturing the same, and the display device according to the embodiments of the present invention enable a capacitor to be formed between a first electrode and a second electrode provided in a GOA circuit area by the following technical measures: providing at least one first via and at least one second via in the GOA circuit area, and providing the first electrode and the second electrode in the GOA circuit area, wherein a data-line metal layer of a TFT area is disposed at the bottom of the at least one first via, and a gate-line metal layer of the TFT area is disposed at the bottom of the at least one second via; the data-line metal layer is electrically connected to one electrode of the first electrode and the second electrode through the at least one first via, and the gate-line metal layer is electrically connected to the other electrode of the first electrode and the second electrode through the at least one second via. As compared to an existing GOA circuit, the GOA circuit employed in the array substrate having such a configuration does not need to additionally provide a capacitor area. Thus, the overall length of the GOA circuit area is reduced, and the width of a frame of the display device is further reduced.
In order to explain embodiments of the present invention or technical solutions in the prior art more clearly, drawings used in description of the embodiments or the prior art will be described briefly as follows. Obviously, the drawings described below are only some embodiments of the present invention, various modifications and variations can be applied to these drawings by a person skilled in the art without creative effort.
Technical solutions according to embodiments of the present invention will be described clearly and completely with reference to the drawings of the embodiments. Obviously, the embodiments as described herein are only some embodiments of the present invention, but not all embodiments of the present invention. Based on the embodiments as described in the present invention, all other embodiments obtained through applying modification and variation to the present invention by a person having ordinary skill in the art without creative effort fall within the protection scope of the present invention.
One embodiment of the present invention provides an array substrate. As shown in
A hierarchical structure of the TFT area 411 used for outputting a gate row-driving signal may be shown as in
In the TFT area 411 of the GOA circuit area 41, the data-line metal layer 51 is electrically connected to a first electrode 53 through the first via A, and the gate-line metal layer 52 is electrically connected to a second electrode 54 through the second via B, such that a capacitor is formed between the first electrode 53 and the second electrode 54.
The array substrate according to the present embodiment enables a capacitor to be formed between the first electrode and the second electrode by the following technical measures: providing the at least one first via and the at least one second via in a GOA circuit area, wherein the data-line metal layer of the TFT area is disposed at the bottom of the at least one first via, and the gate-line metal layer of the TFT area is disposes at the bottom of the at least one second via; the first electrode is electrically connected to the data-line metal layer through the at least one first via, and the second electrode is electrically connected to the gate-line metal layer through the at least one second via. As compared to an existing GOA circuit, the GOA circuit employed in the array substrate having such a configuration does not need to additionally provide a capacitor area. Thus, the length of the GOA circuit area is reduced effectively, and the width of a frame of the display device is further reduced.
Wherein, both the first electrode and the second electrode may be formed of transparent metal oxide material which has semiconductor characteristics. Examples of the transparent metal oxide material may include at lest one of InGaZnO, InGaO, ITZO, and AlZnO.
The array substrate according to the present embodiment may be applied to a liquid crystal display device of Advanced-Super Dimensional Switching (ADS) type, High Resolution ADS (SADS) type, or the like. Using ADS technology, a multi-dimensional electric field is formed through an electric field generated by edges of slit electrodes in the same plane and an electric field generated between a slit-electrode layer and a plate-electrode layer, making liquid crystal molecules of all orientations between slit electrodes and right above slit electrodes in a liquid crystal cell rotate, thereby improving operation efficiency of liquid crystal molecules and increasing light transmission efficiency. The ADS technology may improve image quality of a TFT-LCD product, and has advantages of high resolution, high transmittance, low power consumption, wide viewing angle, high aperture ratio, low chromatic aberration, no push Mura, and the like. For different applications, there are a high transmittance I-ADS technology, a high aperture ratio H-ADS technology, a high resolution S-ADS technology, and the like as improvements of the ADS technology.
Whichever of the above liquid crystal display devices is employed, a color-film substrate and an array substrate which are formed by assembling are included. Wherein, both a common electrode and a pixel electrode are all formed on a surface of the array substrate.
In an array substrate of a display device of ADS type or SADS type, a common electrode and a pixel electrode may be arranged in different layers. Wherein, arrangement in different layers is relative to at least two patterns. At least two patterns arranged in different layers mean that, at least two patterns are respectively formed from at least two layers of transparent electrode film by using patterning processes. Arrangement in different layers relative to two patterns means that, one pattern is formed from each of two layers of transparent electrode film by using a patterning process. For example, a common electrode and a pixel electrode arranged in different layers mean that, a lower layer electrode is formed from a first layer of transparent electrode film by using a patterning process, and an upper layer electrode is formed from a second layer of transparent electrode film by using a patterning process; wherein, the lower layer electrode is the common electrode (or the pixel electrode), and the upper layer electrode is the pixel electrode (or the common electrode).
Furthermore, the display area 42 is also provided with a first transparent electrode and a second transparent electrode. The first transparent electrode and the first electrode may be formed in the same layer by a single patterning process, and the second transparent electrode and the second electrode may be formed in the same layer by a single patterning process. Wherein, arrangement in the same layer is also relative to at least two patterns, and arrangement in the same layer of at least two patterns means that at least two patterns are formed from the same thin film by a patterning process. In an embodiment of the present invention, the first transparent electrode may be a pixel electrode, and the second transparent electrode may be a common electrode; or the first transparent electrode may be a common electrode, and the second transparent electrode may be a pixel electrode.
Furthermore, as shown in
A third electrode 531 integrally formed with the first electrode 53 of the TFT area 411 of the GOA circuit area 41 and a fourth electrode 541 integrally formed with the second electrode 54 of the TFT area 411 of the GOA circuit area 41 such that a capacitor is formed between the third electrode 531 and the fourth electrode 541 in a manner similar to the above.
As compared to the prior art, in the lead-wire area 412, the third electrode 531 is integrally formed with the first electrode 53, and the fourth electrode 541 is integrally formed with the second electrode 54. The third electrode 531 and the fourth electrode 541 may constitute a capacitor of the GOA circuit to remove noise from the circuit. Thus, by providing a capacitor in the lead-wire area, it can be further ensured that capacitance parameter in the GOA circuit also meets the design requirements without a specially provided capacitor area.
Furthermore, as shown in
A gate-insulating layer 55 and a semiconductor active layer 58 which are between the gate-line metal layer 52 and the data-line metal layer 51 of the TFT area 411, wherein the gate-insulating layer 55 is under the semiconductor active layer 58;
A resin layer 56 between the data-line metal layer 51 and the first electrode 53; and
A passivation layer 57 between the first electrode 53 and the second electrode 54.
Furthermore, in the array substrate as shown in
The first via A penetrates through the resin layer 56 to expose the data-line metal layer 51 (alternatively, there may be a passivation layer between the resin layer 56 and the data-line metal layer 51, and in such a case, the first via A further penetrates through this passivation layer). The second via B penetrates through the passivation layer 57, the resin layer 56, and the gate-insulating layer 55 to expose the gate-line metal layer 52 (alternatively, there may be a passivation layer between the resin layer 56 and the gate-insulating layer 55, and in such a case, the second via B further penetrates through this passivation layer).
The circuit structure of the capacitor in such a GOA circuit may be shown as in
It should be noted that, in the array substrate as shown in
An array substrate according to another embodiment of the present invention is shown in
Wherein, the first via A penetrates through the passivation layer 57 and the resin layer 56 to expose the data-line metal layer 51, and the second via B penetrates through the resin layer 56 and the gate-insulating layer 55 to expose the gate-line metal layer 52.
Other aspects of the array substrate according to the present embodiment are the same as the corresponding aspects of the previous embodiment, and description thereof is omitted.
Similarly to the previous embodiment, in an array substrate with such a configuration, as compared to an existing GOA circuit, the GOA circuit used in this array substrate does not need to additionally provide a capacitor area. Thus, the length of the GOA circuit area is reduced effectively, and the width of a frame of a display device is further reduced.
Another embodiment of the present invention provides a display device including the array substrate as described above.
The array substrate particularly includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area used for outputting a gate row-driving signal and a lead-wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise;
Wherein, the GOA circuit area is provided with at least one first via and at least one second via, a data-line metal layer is disposed at the bottom of the at least one first via, and a gate-line metal layer is disposed at the bottom of the at least one second via. The GOA circuit area further includes a first electrode and a second electrode, the data-line metal layer is electrically connected to one electrode of the first electrode and the second electrode through the at least one first via, and the gate-line metal layer is electrically connected to the other electrode of the first electrode and the second electrode through the at least one second via, such that a capacitor is formed between the first electrode and the second electrode. Furthermore, the first electrode and the second electrode may be arranged in the TFT area.
It should be noted that, the display device according to the present invention may be a product or component having any kind of display function, such as a liquid crystal panel, an electronic paper, an OLED panel, a liquid crystal TV, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, and the like.
The display device according to the present embodiment enables a capacitor to be formed between the first electrode and the second electrode by the following technical measures: providing the at least one first via and the at least one second via in the GOA circuit area, and providing the first electrode and the second electrode in the GOA circuit area, wherein the data-line metal layer of the TFT area is disposed at the bottom of the at least one first via, and the gate-line metal layer of the TFT area is disposed at the bottom of the at least one second via; the data-line metal layer is electrically connected to one electrode of the first electrode and the second electrode through the at least one first via, and the gate-line metal layer is electrically connected to the other electrode of the first electrode and the second electrode through the at least one second via. As compared to an existing GOA circuit, the GOA circuit employed in the array substrate having such a configuration does not need to additionally provide a capacitor area. Thus, the length of the GOA circuit area is reduced effectively, and the width of a frame of the display device is further reduced.
Another embodiment of the present invention provides a method for manufacturing an array substrate. The method is used for manufacturing the array substrate as described above. The array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area used for outputting a gate row-driving signal and a lead-wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise; the GOA circuit area further includes a first electrode and a second electrode; furthermore, the first electrode and the second electrode may be arranged in the TFT area.
As shown in
S801: forming a resin layer having a first via on a substrate on which the TFT area is formed such that the first via penetrates through the resin layer to expose a data-line metal layer of the TFT area;
Specifically, the resin layer may be formed on a surface of the substrate, on which the TFT area is formed, by coating, then the first via is formed in the resin layer by a patterning process;
S802: forming a first electrode on the surface of the resin layer such that the first electrode is electrically connected to the data-line metal layer through the first via;
S803: forming a passivation layer having a second via on the substrate on which the first electrode is formed such that the second via penetrates through the passivation layer, the resin layer, and a gate-insulating layer of the TFT area to expose a gate-line metal layer of the TFT area;
Specifically, the passivation layer may be formed through preparing an insulating thin film on the substrate, on which the first electrode is formed, by chemical vapor deposition, thermal evaporation, or the like, and then the second via is formed in the passivation layer by a patterning process; wherein, a single-layer thin film of silicon nitride, silicon oxide or silicon nitride oxide may be used as the insulating thin film, or a multi-layer thin film formed of a plurality of layers of the above material may also be used as the insulating thin film; and
S804: forming a second electrode on the surface of the passivation layer such that the second electrode is electrically connected to the gate-line metal layer through the second via to form a capacitor between the first electrode and the second electrode;
Wherein, both the first electrode and the second electrode may be formed of transparent metal oxide material which have semiconductor characteristics, examples of transparent metal oxide material may include at lest one of InGaZnO, InGaO, ITZO, and AlZnO.
The method for manufacturing an array substrate according to the present embodiment enables a capacitor to be formed between the first electrode and the second electrode by the following technical measures: providing the at least one first via and the at least one second via in the GOA circuit area, and providing the first electrode and the second electrode in the GOA circuit area, wherein the data-line metal layer of the TFT area is disposed at the bottom of the at least one first via, and the gate-line metal layer of the TFT area is disposed at the bottom of the at least one second via; the first electrode is electrically connected to the data-line metal layer through the at least one first via, and the second electrode is electrically connected to the gate-line metal layer through the at least one second via. As compared to an existing GOA circuit, the GOA circuit employed in the array substrate having such a configuration does not need to additionally provide a capacitor area due to the fact that a capacitor can be formed in the TFT area. Thus, the length of the GOA circuit area is reduced effectively, and the width of a frame of the display device is further reduced. It should be noted that, in the present embodiment, description has been made by taking the following as an example: the first electrode is connected to a pixel electrode, and the second electrode is connected to a common electrode.
Furthermore, a first transparent electrode and a second transparent electrode may be further provided in the display area. The first transparent electrode and the first electrode may be formed in the same layer by a single patterning process, and the second transparent electrode and the second electrode may be formed in the same layer by a single patterning process. Wherein, arrangement in the same layer is also relative to at least two patterns, and arrangement in the same layer of at least two patterns means that the at least two patterns are formed by performing a patterning process on the same thin film. In the present embodiment, the first transparent electrode may be a pixel electrode, and the second transparent electrode may be a common electrode.
A third electrode integrally formed with the first electrode and a fourth electrode integrally formed with the second electrode may be further arranged in the lead-wire area. A capacitor is formed between the third electrode and the fourth electrode in a manner similar to the above. Thus, by providing a capacitor in the lead-wire area additionally, it can be further ensured that capacitance parameter in the GOA circuit meets the design requirements without a specially provided capacitor area.
The configuration of the TFT area of the GOA circuit area in the array substrate manufactured by employing such a method for manufacturing an array substrate may be shown as in
Another embodiment of the present invention further provides a method for manufacturing an array substrate. The method is used for manufacturing the array substrate as described above. The array substrate includes a GOA circuit area and a display area, the GOA circuit area includes a TFT area used for outputting a gate row-driving signal and a lead-wire area connected to the TFT area, and the display area includes a data line and a gate line which are arranged crosswise; the GOA circuit area further includes a first electrode and a second electrode; furthermore, the first electrode and the second electrode may be arranged in the TFT area.
As shown in
S901: forming a resin layer having a second via on a substrate on which the TFT area is formed such that the second via penetrates through the resin layer and a gate-insulating layer of the TFT area to expose a gate-line metal layer of the TFT area;
Specifically, the resin layer may be formed on the surface of the substrate, on which the TFT area is formed, by coating, and then the second via is formed in the resin layer by a patterning process;
S902: forming a first electrode on the surface of the resin layer such that the first electrode is electrically connected to the gate-line metal layer through the second via;
S903: forming a passivation layer having a first via on the substrate on which the first electrode is formed such that the first via penetrates through the passivation layer and the resin layer to expose a data-line metal layer of the TFT area;
Specifically, the passivation layer may be formed through preparing an insulating thin film on the substrate, on which the first electrode is formed, by chemical vapor deposition, thermal evaporation, or the like, and then the first via is formed in the passivation layer by a patterning process; wherein, a single-layer thin film of silicon nitride, silicon oxide or silicon nitride oxide may be used as the insulating thin film, or a multi-layer thin film formed of a plurality of layers of the above material may also be used as the insulating thin film; and
S904: forming a second electrode on the surface of the passivation layer such that the second electrode is electrically connected to the data-line metal layer through the first via to form a capacitor between the first electrode and the second electrode;
Wherein, both the first electrode and the second electrode may be formed of transparent metal oxide material which has semiconductor characteristics, examples of transparent metal oxide material may include at lest one of InGaZnO, InGaO, ITZO, and AlZnO.
The method for manufacturing an array substrate according to the present embodiment enables a capacitor to be formed between the first electrode and the second electrode by the following technical measures: providing the at least one first via and the at least one second via in the GOA circuit area, and providing the first electrode and the second electrode in the GOA circuit area, wherein the data-line metal layer of the TFT area is disposed at the bottom of the at least one first via, and the gate-line metal layer of the TFT area is disposed at the bottom of the at least one second via; the second electrode is electrically connected to the data-line metal layer through the at least one first via, and the first electrode is electrically connected to the gate-line metal layer through the at least one second via. As compared to an existing GOA circuit, the GOA circuit employed in the array substrate having such a configuration does not need to additionally provide a capacitor area. Thus, the length of the GOA circuit area is reduced effectively, and the width of a frame of the display device is further reduced.
It should be noted that, in the present embodiment, description has been made by taking the following as an example: the first electrode and the second electrode are arranged in the TFT area. Alternatively, the first electrode and the second electrode may be arranged in the lead-wire area, or may be arranged in both the TFT area and the lead-wire area. Furthermore, the present embodiment has been described by taking the following as an example: the first electrode is connected to a common electrode, and the second electrode is connected to a pixel electrode.
Furthermore, a first transparent electrode and a second transparent electrode may be further provided in the display area. The first transparent electrode and the first electrode may be formed in the same layer by a single patterning process, and the second transparent electrode and the second electrode may be formed in the same layer by a single patterning process. Wherein, arrangement in the same layer is also relative to at least two patterns, and arrangement in the same layer of at least two patterns means that the at least two patterns are formed by performing a patterning process on the same thin film. In the present embodiment, the first transparent electrode may be a common electrode, and the second transparent electrode may be a pixel electrode.
A third electrode integrally formed with the first electrode and a fourth electrode integrally formed with the second electrode may be further arranged in the lead-wire area. A capacitor is formed between the third electrode and the fourth electrode. Thus, by providing a capacitor in the lead-wire area additionally, it can be further ensured that capacitance parameter in the GOA circuit meets the design requirements without a specially provided capacitor area.
The configuration of the TFT area of the GOA circuit in the array substrate manufactured by employing such a method for manufacturing an array substrate may be shown as in
The foregoing are only exemplary embodiments of the present invention, and the protection scope of the present invention is not limited thereto. Modifications and variations easily conceived by a person skilled in the art without departing from the technical scope disclosed by the present invention all fall within the protection range of the present invention. Therefore, the protection scope of the present invention is defined by the claims.
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