Disclosed is drum-type IC burn-in and test equipment including burn-in equipment. The burn-in equipment includes therein a first working platform, a second working platform, a drum-type burn-in device, and a parts pickup device. The first working platform includes a first parts disposition section and a parts feeding device. The second working platform includes a parts transferring device. The drum-type burn-in device is rotatably mounted between the first and second working platforms and includes multiple planar sections circumferentially mounted thereto with each planar section having at least one burner mounted thereon. This arrangement allows a parts feeding device to sequentially dispose unburned ICs and a parts transferring device to sequentially pick up completely-burned ICs. As such, the drum-type burn-in device helps increase the number of ICs disposed and also helps improve the throughput and increase the manufacturing speed.
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17. A drum-type test equipment, comprising:
a drum-type testing device configured to rotate with respect to a rotation axle of the drum-type testing device, wherein the drum-type testing device comprises multiple planar sections circumferentially mounted thereto and configured to rotate with respect to the rotation axle; and
a parts pickup device over the drum-type testing device, wherein the parts pickup device comprises a parts pickup suction nozzle configured to pick up a part from a first parts disposition seat to one of the planar sections and to pick up the part from said one of the planar sections to a second parts disposition seat.
10. A drum-type burn-in and test equipment, comprising:
a parts feeding device comprising a first parts pickup suction nozzle configured to pick up a part from a first parts disposition seat to a second parts disposition seat in a path where the part is moved in a direction;
a parts transferring device comprising a second parts pickup suction nozzle configured to pick up the part from a third parts disposition seat to a fourth parts disposition seat in a path where the part is moved in the direction;
a drum-type burn-in device configured to rotate with respect to a rotation axle of the drum-type burn-in device parallel to the direction, wherein the drum-type burn-in device comprises multiple planar sections circumferentially mounted thereto and configured to rotate with respect to the rotation axle, wherein the drum-type burn-in device comprises a burner mounted to one of the planar sections; and
a parts pickup device over the drum-type burn-in device, wherein the parts pickup device comprises a third parts pickup suction nozzle configured to pick up the part from the second parts disposition seat to one of the planar sections in a path where the part is moved in the direction and to pick up the part from said one of the planar sections to the third parts disposition seat in a path where the part is moved in the direction.
1. A drum-type IC (Integrated Circuit) burn-in and test equipment, comprising:
a parts feeding device comprising a first horizontal displacement device and a first vertical displacement device, wherein the first vertical displacement device comprises a first parts pickup suction nozzle configured to pick up a part from a first parts disposition seat to a second parts disposition seat in a path where the part is moved in a horizontal direction by the first horizontal displacement device;
a parts transferring device comprising a second horizontal displacement device and a second vertical displacement device, wherein the second vertical displacement device comprises a second parts pickup suction nozzle configured to pick up the part from a third parts disposition seat to a fourth parts disposition seat in a path where the part is moved in the horizontal direction by the second horizontal displacement device;
a drum-type burn-in device comprising a rotation axle, wherein the drum-type burn-in device configured to rotate with respect to the rotation axle parallel to the horizontal direction, wherein the drum-type burn-in device comprises multiple planar sections circumferentially mounted thereto and configured to rotate with respect to the rotation axle, wherein the drum-type burn-in device comprises a burner mounted to one of the planar sections; and
a parts pickup device arranged above the drum-type burn-in device, wherein the parts pickup device comprises a third horizontal displacement device, wherein the third horizontal displacement device comprises a third parts pickup suction nozzle configured to pick up the part from the second parts disposition seat to one of the planar sections in a path where the part is moved in the horizontal direction by the third horizontal displacement device, wherein the third parts pickup suction nozzle is configured to pick up the part from said one of the planar sections to the third parts disposition seat in a path where the part is moved in the horizontal direction by the third horizontal displacement.
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The present invention generally relates to drum-type IC (Integrated Circuit) burn-in and test equipment, and more particularly to an arrangement that comprises a drum-type burn-in device comprises a plurality of planar sections circumferentially mounted thereto and each planar section comprise at least one burner mounted thereto so that with the drum-type burn-in device being rotatably mounted between a first working platform and a second working platform, a parts feeding device is operable to sequentially dispose unburned ICs and a parts transferring device is operable to sequentially pick up completely-burned ICs so that the drum-type burn-in device helps increase the number of ICs disposed so as to improve the throughput and to increase the manufacturing speed.
To pick up and place an integrated circuit (IC), a robotic arm of conventional burn-in equipment is structured such that a linearly movable X-shaft carries and moves a linearly movable Y-shaft to carry out positioning in a horizontal coordinate system and afterwards, a linearly movable Z-shaft carried by the Y-shaft carries performs a vertical movement to pick up or place the IC. This process is sequentially and cyclically performed. However, the three shafts are arranged together in such a way that they cannot carry out parallel operations and this affects the manufacture greatly. Further, the conventional burn-in equipment is provided with image recognition assemblies to detect positional shift of an IC before it is disposed in a burn-in device of the conventional burn-in equipment. This increases the complexity of the Z-shaft mechanism and also indirectly increases the torque loading of the X and Y motion shaft, eventually leading to a drawback of increasing manufacturing cost. Thus, there is still room for improvement of operation flows of feeding, burning, and conveying among components of the conventional burn-in equipment.
Conventional IC burn-in equipment generally comprises a parts feeding section, wherein the parts feeding section comprises a parts feeding suction nozzle for picking up an unburned IC through a suction force and the parts feeding section is driven by a servo motor so as to have the parts feeding section horizontally movable for conveying an IC to a parts disposition section; a parts disposition section, wherein the parts disposition section comprises a parts disposition seat and the parts disposition seat functions to receive ICs to be burned to dispose therein; a plurality of burners, wherein the burners are operable to retain ICs thereon; a displacement arm, wherein the displacement arm is driven by the servo motor and the displacement arm comprises a first parts transferring suction nozzle, whereby when the parts disposition seat has ICs disposed therein, the first parts transferring suction nozzle of the displacement arm is rotated toward the parts disposition seat for being ready to pick up the unburned ICs through suction force and when the first parts transferring suction nozzle picks up, through suction forces, the unburned ICs of the parts disposition seat for being sequentially moved to the burners to be disposed thereon and waits for the burning operation to be completed, the first parts transferring suction nozzle picks up the completely-burned IC through suction forces to be sequentially moved to and disposed in the parts disposition seat so as to repeatedly and successively the burning and dispensing operations to achieve the effect of burning ICs.
The conventional IC burn-in equipment, although effective in burning ICs, must have each burner waiting for the displacement arm to dispose an IC thereon before a burning operation can be carried out because the displacement arm is just a single arm and is rotatable only on a plane. This leads to a drawback of greatly extending the time period of burning operation. Further, the number of the burners that can be reachable by the displacement arm is susceptible to space limitation, making it is not possible to increase the number of burners installed, whereby the available number of ICs that can be disposed in the conventional IC burn-in equipment may be insufficient, making it no possible to increase the throughput of IC and thus the manufacturing speed is reduced.
Thus, the present invention aims to overcome the technical difficulty of the above-discussed issues.
In view of the drawbacks of the conventional IC burn-in equipment that the number of the burners cannot be increased and the manufacturing speed is low, an object of the present invention is to provides drum-type IC burn-in and test equipment, wherein a drum-type burn-in device comprises a plurality of planar sections circumferentially mounted thereto and each of the planar sections comprises at least one burner mounted thereon and wherein the drum-type burn-in device is rotatably mounted between a first working platform and a second working platform to allow a parts feeding device to sequentially dispose unburned ICs thereon, whereby completely-burned Ics can be sequentially picked up by a parts transferring device so that, with the drum-type burn-in device, an effect of increasing the number of ICs disposed can be achieved so as to improve the throughput and to increase the manufacturing speed.
To achieve the above object, the present invention provides drum-type IC burn-in and test equipment, which comprises:
burn-in equipment, wherein the burn-in equipment comprises therein a first working platform, a second working platform, a drum-type burn-in device, and a parts pickup device. The first working platform comprises a first parts disposition section. The first working platform comprises a parts feeding device. The parts feeding device comprises a horizontal displacement device and the displacement device comprises a vertical displacement device. The vertical displacement device comprises a first parts pickup suction nozzle. The second working platform comprises a second parts disposition section. The second working platform comprises a parts transferring device. The parts transferring device comprises a horizontal displacement device and the displacement device comprises a vertical displacement device. The vertical displacement device comprises a second parts pickup suction nozzle. The drum-type burn-in device comprises a rotation axle and the drum-type burn-in device is rotatably mounted between the first working platform and the second working platform. The drum-type burn-in device comprises a plurality of planar sections circumferentially mounted thereto and each of the planar sections comprises at least one burner mounted thereto. The parts pickup device is arranged above the drum-type burn-in device.
The drum-type IC burn-in and test equipment provided by the present invention provides a drum-type burn-in device that comprises a plurality of planar sections circumferentially mounted thereto and each of the planar sections comprises at least one burner mounted thereto. The drum-type burn-in device is rotatably mounted between a first working platform and a second working platform to allow a parts feeding device to sequentially dispose unburned Ics thereon. A parts transferring device may later be used to sequentially pick up completely-burned ICs. Thus, with the drum-type burn-in device, the number of ICs can be can be disposed is increased so that the throughput can be increased and the manufactured speed enhanced.
The foregoing objectives and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts.
Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example.
The following descriptions are exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope of the invention as set forth in the appended claims.
Referring to
The burn-in equipment 10 comprises a first working platform 20, a second working platform 30, a drum-type burn-in device 40, and a parts pickup device 90. The first working platform 20 comprises, mounted therein, a parts disposition seat displacement device 202 and the first working platform 20 is provided with a first parts disposition section 21, and the first parts disposition section 21 is arranged on the parts disposition seat displacement device 202, as shown in
Referring to
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It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above.
While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.
Wong, Ching-Chang, Wang, An-Sung
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Dec 03 2014 | WANG, AN-SUNG | WANG, AN-SUNG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 034587 | /0566 | |
Dec 03 2014 | WONG, CHING-CHANG | WANG, AN-SUNG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 034587 | /0566 | |
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Dec 26 2014 | Ching-Chang, Wong | (assignment on the face of the patent) | / |
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