A rack apparatus includes a frame having (i) a power and cooling area and (ii) a block chassis forming one or more information technology (IT) bays that enable insertion of IT components. A plurality of IT components are contained within a component cabinet inserted in the block chassis. When operational, enable the rack apparatus to function as one of an information handling system (IHS) and an extension of a modular, scalable/expandable rack-based IHS. A busbar physically located at a back of the block chassis within the power and cooling area and enables direct coupling to one of another busbar and a power source to supply power to the plurality of IT components from a power interface board. A block controller is contained in the block chassis and communicatively coupled to the other IT components. The block controller performs all localized, block level control for the rack apparatus.
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1. A rack apparatus, comprising:
a frame comprising (i) a power and cooling area and (ii) a block chassis forming one or more;
a plurality of information technology (IT) components contained within a component cabinet inserted in the block chassis and which, when operational, enable the rack apparatus to function independently as an information handling system (IHS);
a first busbar physically located at a back of the block chassis within the power and cooling area and which enables direct coupling to at least one of a second busbar and a power source to supply power to the plurality of IT components;
a power interface board contained in the block chassis and coupled to the first busbar to supply power to the IT components contained in the component cabinet;
a block controller contained in the block chassis and communicatively coupled to the plurality of IT components and which performs all block level control for the rack apparatus; and
one or more physical supports at a bottom surface of the frame that enable the rack apparatus to be physically placed on top of a modular, expandable IT rack.
10. An information handling system (IHS), comprising:
a frame comprising (i) a power and cooling area and (ii) a block chassis forming one or more information technology (IT) bays;
a plurality of IT components contained within a component cabinet inserted in the block chassis and which, when operational, enable the IHS to function as an extension of a modular, expandable rack-based IHS;
a first busbar physically located at a back of the block chassis within the power and cooling area, and which is directly coupled to one of a second busbar and a power source to supply power to the plurality of IT components;
a power interface board contained in the block chassis and coupled to the first busbar to supply power to the plurality of IT components contained in the component cabinet;
a block controller contained in the block chassis and communicatively coupled to the plurality of IT components and which performs all block level control for the IHS; and
one or more physical supports at a bottom surface of the frame that enable the IHS to be physically placed on top of the modular, expandable IT rack.
19. A method for providing a rack assembly to function as a physically attachable extension of a modular, scalable/expandable rack-based IHS, the method comprising:
assembling a frame comprising a power and cooling area and a block chassis forming one or more information technology (IT) bays;
providing a plurality of IT components within a component cabinet inserted in the block chassis and which, when operational, enable the rack apparatus to function as one or more blocks of a plurality of blocks supported by the modular, scalable/expandable rack-based IHS;
attaching a first busbar within the power and cooling area, which is physically located at a back of the block chassis, wherein the first busbar enables direct coupling to one of a second busbar and a power source to supply power to the plurality of IT components;
coupling a power interface board, which is contained in the block chassis, to the first busbar to supply power to the plurality of IT components contained in the component cabinet, wherein one or more of the plurality IT components have power connectors/conductors that are physically abutting to one of the busbar and the power interface board to receive electrical power;
communicatively coupling a block controller, which is contained in the block chassis and which performs all block level control for the rack assembly, to the plurality of IT components; and
providing one or more physical supports to a bottom surface of the frame that enable the rack apparatus to be physically placed on top of a modular, expandable IT rack.
2. The rack apparatus of
3. The rack apparatus of
a fan bay located within the power and cooling area;
one or more fan modules inserted within the fan bay; and
one or more cables that connect the one or more fan modules to the block controller to enable the block controller to independently operate each of the one or more fan modules.
4. The rack apparatus of
5. The rack apparatus of
6. The rack apparatus of
a power bay chassis;
an infrastructure manager (IM) contained in the power bay chassis and communicatively coupled to the block controller to perform rack management and enable cooling of the plurality of IT components; and
a rack management controller (RMC) contained in the power bay chassis and which is communicatively coupled to the block controller to perform control of the modular, expandable IT rack, when connected thereto;
one or more power supply units (PSUs) contained in the power bay chassis to provide electrical power; and
a power bay power module contained in the power bay chassis and electrically coupled to the busbar and the one or more PSUs to receive the electrical power.
7. The rack apparatus of
a set of mount ear assemblies attached to a top portion of the block chassis; and
a set of power bay brackets attached to lateral sides of the power bay chassis in a vertical position corresponding to each position of the set of mount ear assemblies and aligned for vertical engagement, wherein the power bay chassis is slid into a stacked position with the block chassis.
8. The rack apparatus of
a second plurality of IT components contained within a second component cabinet inserted in the second block chassis;
another busbar segment within the power and cooling area that enables direct coupling to one of the busbar and the power source to supply power to the second plurality of IT components and which is physically located at a back of the second block chassis; and
a second power interface board contained in the second block chassis and coupled to the other busbar to supply power to the second plurality of IT components contained in the second component cabinet, wherein one or more of the second plurality of IT components have power connectors/conductors that are physically abutting to one of the other busbar segment and the second power interface board to receive electrical power.
9. The rack apparatus of
11. The IHS of
12. The IHS of
a fan bay located within the power and cooling area;
one or more fan modules inserted within the fan bay; and
one or more cables that connect the one or more fan modules to the block controller to enable the block controller to independently operate each of the one or more fan modules.
13. The IHS of
14. The IHS of
15. The IHS of
a power bay chassis;
an infrastructure manager (IM) contained in the power bay chassis and communicatively coupled to the block controller to perform rack management and cooling of the plurality of IT components;
a rack management controller (RMC) contained in the power bay chassis and which is communicatively coupled to the block controller to perform control of the modular, expandable IT rack;
one or more power supply units (PSUs) contained in the power bay chassis to provide electrical power; and
a power bay power module contained in the power bay chassis and electrically coupled to the one or more PSUs to receive the electrical power and electrically coupled to the busbar.
16. The IHS of
a set of mount ear assemblies attached to a top portion of the block chassis; and
a set of power bay brackets attached to lateral sides of the power bay chassis corresponding to the set of mount ear assemblies and aligned for vertical sliding engagement, wherein the power bay chassis is in a stacked position with the block chassis.
17. The IHS of
a second plurality of IT components contained within a second component cabinet inserted in the second block chassis;
the other busbar within the power and cooling area that enables direct coupling to one of the busbar and the power source to supply power to the second plurality of IT components and which is physically located at a back of the second block chassis; and
a second power interface board contained in the second block chassis and coupled to the other busbar to supply power to the second plurality of IT components contained in the second component cabinet, wherein one or more of the second plurality of IT components have power connectors/conductors that are physically abutting to one of the other busbar and the other power interface board to receive electrical power.
18. The IHS of
20. The method of
attaching a fan bay located within the power and cooling area;
inserting one or more fan modules within the fan bay; and
connecting one or more cables between the one or more fan modules and the block controller to enable the block controller to independently operate each of the one or more fan modules.
21. The method of
when the rack apparatus is a stand-alone system, providing the plurality of IT components comprise providing at least one computing device node; and
when the rack apparatus is to be integrated as a part of modular, scalable/expandable rack:
providing the plurality of IT components comprise providing at least one of storage device nodes and computing device nodes; and
the method further comprises communicatively connecting an Ethernet cable between the block controller and a rack management controller (RMC) of the modular, scalable/expandable rack-based IHS to enable the RMC to provide control for the rack apparatus as a part of the rack-based IHS via communication with the block controller.
22. The method of
assembling the frame further comprising providing a power bay chassis;
communicatively coupling an infrastructure manager (IM), which is contained in the power bay chassis and which controls block cooling, to the block controller to perform rack management of the plurality of IT components;
providing a rack management controller (RMC) in the power bay chassis that is in communication with the block controller to perform system level control;
providing one or more power supply units (PSUs) in the power bay chassis to provide electrical power; and
electrically coupling a power bay power module, which is contained in the power bay chassis, to the one or more PSUs to receive the electrical power.
23. The method of
attaching a set of mount ear assemblies to a top portion of the block chassis; and
attaching a set of power bay brackets to lateral sides of the power bay chassis at locations corresponding to opposing locations of the set of mount ear assemblies and aligned for vertical engagement as the power bay chassis is placed upon the block chassis.
24. The method of
forming in the block chassis one or more downwardly-presented female key hole fastener components; and
forming in a second block chassis one or more corresponding, upwardly presented male key hole fastener components, wherein the one or more downwardly-presented female key hole fastener components are aligned to receive the one or more corresponding, upwardly presented male key hole fastener components.
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1. Technical Field
The present disclosure generally relates to an information handling system and in particular to a modular, expandable rack-based information handling system and design.
2. Description of the Related Art
As the value and use of information continue to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system (IHS) generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes, thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
Large scale information handling systems, as utilized within data centers, are often designed in a rack configuration, having one or more servers and/or banks of storage physically located within a single rack chassis. The number of servers and thus the computing power that can be placed in these rack chassis is limited by the maximum height of the rack chassis. A large number of the conventional rack chassis are built to conform to a specific industry height, which is based in part on the desire of the various manufacturers to be able to move the racks through a minimum door size of a data center facility or to fit vertically upright within a facility having a minimum vertical clearance. Thus, for uniformity, most racks are built to a standard height to accommodate use in the lowest ceiling heights in which the racks are deployed. However, in many applications, the vertical heights of the doorway at the data center can be much lower than the ceiling height of the actual data center. Customers who desire larger computing capabilities than is provided within a single rack are forced to purchase two such racks and fit them within the allocated space, often side-by-side. These racks are individual computing systems that then have to be physically configured for use with each other. Conversely, customers who only desire a smaller number of servers within some sort of rack chassis structure are forced to purchase and full height rack chassis and fill only some of the bays with servers, leaving the remainder of the chassis empty.
Disclosed are a rack apparatus, an information handling system (IHS), and a method for enabling the rack apparatus to function as one of an IHS and an extension of a modular, scalable and expandable (MSE) rack-based IHS. According to at least one aspect of the present disclosure, a rack apparatus includes a frame having (i) a power and cooling area and (ii) a block chassis forming one or more IT bays that enable insertion of IT components. A plurality of IT components is contained within a component cabinet inserted in the block chassis. When operational, the plurality of IT components enables the rack apparatus to function as one of (i) a self-contained IHS and (ii) an extension of a MSE rack-based IHS. A busbar is physically located at a back of the block chassis within the power and cooling area and enables direct coupling to one of another busbar and a power source to supply power to the plurality of IT components. A power interface board is contained in the block chassis and coupled to the busbar to supply power to the IT components contained in the component cabinet. A block controller is contained in the block chassis and communicatively coupled to the other IT components. The block controller performs all block level control for the rack apparatus. One or more physical supports at a bottom surface of the frame enable the rack apparatus to be physically placed on top of a modular, expandable IT rack.
According to at least one additional aspect of the present disclosure, an IHS includes a frame comprising (i) a power and cooling area and (ii) a block chassis forming one or more IT bays that enable insertion of IT components. A plurality of IT components is contained within a component cabinet inserted in the block chassis. A busbar is physically located at a back of the block chassis within the power and cooling area, directly coupled to one of another busbar and a power source to supply power to the plurality of IT components. A power interface board is contained in the block chassis and coupled to the busbar to supply power to the IT components contained in the component cabinet. A block controller is contained in the block chassis and communicatively coupled to the other IT components and which performs all block level control for the rack apparatus. One or more physical supports are located at a bottom surface of the frame that enable the rack apparatus to be physically placed on top of the modular, expandable IT rack.
According to another aspect of the present disclosure, a method includes assembling a frame comprising a power and cooling area and a block chassis forming one or more information technology (IT) bays that enable insertion of IT components; providing a plurality of IT components within a component cabinet inserted in the block chassis and which, when operational, enable the rack apparatus to function as one or more blocks of a plurality of blocks within a MSE rack-based IHS. The method further includes attaching a busbar within the power and cooling area, which is physically located at a back of the block chassis, wherein the busbar enables direct coupling to one of (a) another busbar and (b) a power source to supply power to the plurality of IT components. A power interface board, which is contained in the block chassis, is coupled to the busbar to supply power to the IT components contained in the component cabinet. One or more of the IT components have power connectors/conductors that are physically abutting to one of the busbar and the power interface board to receive electrical power. The method further includes communicatively coupling a block controller, which is contained in the block chassis and which performs all block level control for the rack assembly, to the other IT components; and providing one or more physical supports to a bottom surface of the frame that enable the rack apparatus to be physically placed on top of a modular, expandable IT rack.
The above presents a general summary of several aspects of the disclosure in order to provide a basic understanding of at least some aspects of the disclosure. The above summary contains simplifications, generalizations and omissions of detail and is not intended as a comprehensive description of the claimed subject matter but, rather, is intended to provide a brief overview of some of the functionality associated therewith. The summary is not intended to delineate the scope of the claims, and the summary merely presents some concepts of the disclosure in a general form as a prelude to the more detailed description that follows. Other systems, methods, functionality, features and advantages of the claimed subject matter will be or will become apparent to one with skill in the art upon examination of the following figures and detailed written description.
The description of the illustrative embodiments can be read in conjunction with the accompanying figures. It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the figures presented herein, in which:
A rack-based information handling system (IHS) is designed to be advantageously modular and scalable in order to deploy blocks of processing nodes in accordance to the need of a stand-alone IHS or of a larger rack.
In the following detailed description of exemplary embodiments of the disclosure, specific exemplary embodiments in which the disclosure may be practiced are described in sufficient detail to enable those skilled in the art to practice the disclosed embodiments. For example, specific details such as specific method orders, structures, elements, and connections have been presented herein. However, it is to be understood that the specific details presented need not be utilized to practice embodiments of the present disclosure. It is also to be understood that other embodiments may be utilized and that logical, architectural, programmatic, mechanical, electrical and other changes may be made without departing from general scope of the disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims and equivalents thereof.
References within the specification to “one embodiment,” “an embodiment,” “embodiments”, or “one or more embodiments” are intended to indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. The appearance of such phrases in various places within the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Further, various features are described which may be exhibited by some embodiments and not by others. Similarly, various requirements are described which may be requirements for some embodiments but not other embodiments.
It is understood that the use of specific component, device and/or parameter names and/or corresponding acronyms thereof, such as those of the executing utility, logic, and/or firmware described herein, are for example only and not meant to imply any limitations on the described embodiments. The embodiments may thus be described with different nomenclature and/or terminology utilized to describe the components, devices, parameters, methods and/or functions herein, without limitation. References to any specific protocol or proprietary name in describing one or more elements, features or concepts of the embodiments are provided solely as examples of one implementation, and such references do not limit the extension of the claimed embodiments to embodiments in which different element, feature, protocol, or concept names are utilized. Thus, each term utilized herein is to be given its broadest interpretation given the context in which that terms is utilized.
In
A busbar 114 physically located at a back 116 of the block chassis 106 within the power and cooling area 104 enables direct coupling to one of another busbar 114 (
In one illustrative use, the rack-based 101 facilitates flexibly deploying processing capabilities. In particular, a height of a typical Information Technology (IT) rack can exceed the height restrictions found in some IT environments making it very difficult or impossible to deploy a full height rack. In addition, typical IT racks have a fixed height and payload capacity. In order for the end user to increase payload capacity, the rack must be removed and replaced with a taller rack or an additional rack added. This creates downtime, expense and requires additional floor space. The rack apparatus 100 of the present disclosure enables a deployment of a larger height system using at least two separate components, including the rack apparatus, and a larger rack chassis with blocks of processing nodes. The rack apparatus 100 is designed to be fixably attached atop the larger rack chassis to provide a vertically aligned series of processing blocks within a single rack that collectively operates as a single rack-based information handling system.
Returning to the
In one aspect, block controller 220 can include an Ethernet jack that enables the block controller 220 to be communicatively connected to a rack management controller (RMC) 238 of a larger rack assembly via an Ethernet cable to enable the RMC 238 to provide system level control for the rack apparatus 200 via communication with the block controller 220 when the rack apparatus 200 is integrated as a part of the larger rack assembly.
In one embodiment of the rack apparatus 200, the IM 227 in the power bay chassis 226 utilizes rapid input/output (RapidIO) and the block chassis 206 contains a block controller distribution board 240. The IM 227 communicates with the block controller 220 via RapidIO and the block controller distribution board 240 in order to perform rack management and enable block cooling of the plurality of IT components. The RMC 238 in the power bay chassis 226 is communicatively coupled to the block controller 220 to perform system level control. One or more power supply units (PSUs) 242 provide electrical power to a power module 244. Both the PSUs 242 and power module 244 are contained in the power bay chassis 226. The PSUs 242 are electrically coupled to the busbar 214 via the power bay power module 244.
With reference to
In
With reference to
Referring specifically to
As presented in
Infrastructure manager 827 includes cooling subsystem interface 841, Ethernet switch 848, power distribution interface 845 and network interface 847. Network interface 847 enables IHS 801 and specifically the components within IHS 801 to connect to communicate with or via an external network 849.
In addition to the above described MC 838 and IM 827, IHS 801 further comprises a fan and cooling subsystem 850, power subsystem 828, and a plurality of processing blocks 852, individually labeled as blocks A-D 852a-852d. In one implementation, each block 852 has an associated block controller (BC) 820. Cooling subsystem 850 includes a plurality of fan modules, or merely “fans”, of which a first fan 834a and a second fan 834b are shown. These fans 834a, 834b are located within a respective fan bay module 832 and can be different sizes and provide different numbers of fans 834 per fan bay module 832. One or more aspects of the modularity of the cooling subsystem and particularly the fan modules are presented within the descriptions which follow, with reference to one or more of the three-dimensional figures. Also included within cooling subsystem 850 is a plurality of temperature sensors 854, which are further shown distributed within or associated with specific blocks 852. Cooling subsystem 850 of IHS 801 further includes some design features of the rack casing or frame 802, such as perforations for air flow and other design features not expanded upon within the present description. As alluded to by the dashed boxes representing the individual fans 834a-834b, each fan 834a-834b is located behind (or in the air flow path of) a specific block 852 and the fan 834a-834b is communicatively coupled to and controlled by the block controller 820 associated with that block 852. Within each block 852 is at least one, and likely a plurality, of functional/processing nodes 856. As one aspect of the disclosure, the number of nodes that can be placed within each block and/or supported by a single block controller can vary up to a maximum number (e.g., 16) based on the block dimension relative to the size and configuration of each processing node. Additionally, as provided by block D 852d, one or more of the blocks can be utilized to provide rack-storage of storage devices. Also, as shown with blocks B 852b and C 852c, a single block controller 820b can be assigned to control multiple blocks 852b-852c, when the number of processing nodes 856 within an individual block does not exceed the pre-established block controller (BC) threshold. In at least one implementation, the BC threshold can be set to 16 nodes. Each node 856 controlled by a respective block controller 820 is communicatively coupled to block controller 820 via one or more cables.
Switch 848 enables MC 838 to communicate with block controllers 820 via a network of Ethernet cables 836. Specifically, according to at least one embodiment, MC 838 provides certain control and/or management signals to BCs 820 via one or more select wires within the Ethernet cables 836, which select wires are additional wires within the Ethernet cable that are not utilized for general system and network communication.
Power subsystem 828 generally includes a plurality of power supply units (PSUs) 842, one or more power distribution units (PDUs) 858, and a modular busbar 814. Power subsystem 828 also includes a source of external power (not shown), assumed to be AC power 860. Each of the individual nodes 856 and other components within the IHS 801 that require power are either directly coupled to modular busbar 814 or coupled via power cables to PDUs 858 to obtain power. As one aspect of power distribution within IHS 801, MC 838 can monitor power consumption across the IHS 801 as well as the amount of available power provided by the functional PSUs 842 and trigger changes in power consumption at the block level and ultimately at the (processing) node level based on changes in the amount of available power and other factors. Control of the power subsystem 828 can, in one embodiment, be provided by a separate power controller 862, separate from MC 838. As further illustrated, one additional aspect of the power system for the IHS 801 is the inclusion of AC switch box 864. AC switch box 864 is communicatively coupled to both IM 827 and power subsystem 828. AC switch box 864 includes a plurality of AC inputs 866 and a plurality of AC outlets 868 that are utilized to supply power to the PSUs 842, and other functional components of the IHS 801 that require AC power.
In an exemplary embodiment, components of the IHS 801 can be organized into a hierarchy as described in TABLE A:
TABLE A
Level
Device/Module
Acronym
Comments
Domain Level
Management Controller
MC
In front of Power Bay
Domain Level
Infrastructure module
IM
In rear of Power Bay
Domain Level
AC Switch Box
ACSB
Behind network switches
Domain Level
Power Bay Power Module
PBPM
Connects to 10 supplies and two
MCs. Designed by Delta
Domain Level
Power Bay
Power Bay
Holds PBPM, MCx2, IM, &
ACSB
Block Level
Block Controller
BC
Hot plug Fan controller + Serial
& node interface
Block Level
Block Controller
BCDB
Fixed in Block
Distribution Board
Block Level
Power Interface Board
PIB
Columns of 4 nodes
Block Level
Temperature Probe Board
TPB
Ambient Temperature Sensor
Node Level
Node Power Distribution
NPDB
In each node
Board
Node Level
4 drive HDD BP
x4HDDBP
Used in 12 drive FW HP sled
Node level
2 drive HDD PB
x2HDDBP
Used for HP 2.5″ in HW sled
Those of ordinary skill in the art will appreciate that the hardware components and basic configuration depicted in the various figures (e.g.
In the above described flow charts of
One or more of the embodiments of the disclosure described can be implementable, at least in part, using a software-controlled programmable processing device, such as a microprocessor, digital signal processor or other processing device, data processing apparatus or system. Thus, it is appreciated that a computer program for configuring a programmable device, apparatus or system to implement the foregoing described methods is envisaged as an aspect of the present disclosure. The computer program may be embodied as source code or undergo compilation for implementation on a processing device, apparatus, or system. Suitably, the computer program is stored on a carrier device in machine or device readable form, for example in solid-state memory, magnetic memory such as disk or tape, optically or magneto-optically readable memory such as compact disk or digital versatile disk, flash memory, etc. The processing device, apparatus or system utilizes the program or a part thereof to configure the processing device, apparatus, or system for operation.
While the disclosure has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular system, device or component thereof to the teachings of the disclosure without departing from the essential scope thereof. Therefore, it is intended that the disclosure not be limited to the particular embodiments disclosed for carrying out this disclosure, but that the disclosure will include all embodiments falling within the scope of the appended claims. Moreover, the use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the disclosure in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the disclosure. The described embodiments were chosen and described in order to best explain the principles of the disclosure and the practical application, and to enable others of ordinary skill in the art to understand the disclosure for various embodiments with various modifications as are suited to the particular use contemplated.
Vivio, Joseph Andrew, Bailey, Edmond
Patent | Priority | Assignee | Title |
10562757, | Sep 06 2007 | DEKA Products Limited Partnership | Product dispensing system |
10642319, | Jan 05 2018 | QUANTA COMPUTER INC. | Flexible stacked up chassis |
11427462, | Sep 06 2007 | DEKA Products Limited Partnership | Product dispensing system |
11738989, | Sep 06 2007 | DEKA Products Limited Partnership | Product dispensing system |
Patent | Priority | Assignee | Title |
8203828, | Jan 27 2005 | PRODUCTION RESOURCE GROUP L L C | Portable power and signal distribution system for a controllable system including multiple devices |
9019707, | Sep 21 2012 | Inventec (Pudong) Technology Corporation; Inventec Corporation | Server system |
20040257766, | |||
20130194726, | |||
20130198532, |
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