Patent
   D405430
Priority
Jan 31 1997
Filed
Jul 24 1997
Issued
Feb 09 1999
Expiry
Feb 09 2013
Assg.orig
Entity
unknown
28
4
n/a
I claim the ornamental design for inner tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1: a perspective view of a inner tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2: a front elevational view thereof, the rear elevational view, the right side view and the left side view are identical with the front view;

FIG. 3: a top plan view thereof;

FIG. 4: a bottom plan view thereof; and,

FIG. 5: a cross sectional view thereof taken along line V-V in FIG. 3.

Matsushima, Noriaki

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Patent Priority Assignee Title
4857689, Mar 23 1988 Axcelis Technologies, Inc Rapid thermal furnace for semiconductor processing
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 1997Tokyo Electron Limited(assignment on the face of the patent)
Nov 07 1997MATSUSHIMA, NORIAKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0088310245 pdf
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