Semiconductor power package with three leads

Abstract

Description

FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a front elevational view thereof.

Claims

The ornamental design for a semiconductor power package with three leads, as shown and described.