Patent
   D491206
Priority
Dec 20 2002
Filed
Jun 20 2003
Issued
Jun 08 2004
Expiry
Jun 08 2018
Assg.orig
Entity
unknown
2
9
n/a
The ornamental design for a electrostatic chuck, as shown and described.

FIG. 1 is a perspective view of the top, front and right side of an electrostatic chuck showing my new design;

FIG. 2 is a front elevational view thereof, the rear elevational view being a mirror image thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a sectional view taking along the line 7--7 in FIG. 5.

Okugawa, Keisuke

Patent Priority Assignee Title
10679884, Feb 23 2015 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC Film electrode for electrostatic chuck
D644497, Sep 17 2010 OmniCubed, Inc.; OMNI CUBED, INC Solid surface seaming apparatus
Patent Priority Assignee Title
5474614, Jun 10 1994 Texas Instruments Incorporated Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp
5656093, Mar 08 1996 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
5671116, Mar 10 1995 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
5675471, Jul 19 1994 GLOBALFOUNDRIES Inc Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
5838528, Jul 10 1995 Applied Materials, Inc Electrostatic chuck assembly
6513796, Feb 23 2001 International Business Machines Corporation Wafer chuck having a removable insert
6639783, Sep 08 1998 ABL IP Holding, LLC Multi-layer ceramic electrostatic chuck with integrated channel
D420022, May 08 1996 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
D425919, Nov 14 1997 Applied Materials, Inc Electrostatic chuck with improved spacing mask and workpiece detection device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 20 2003NGK Spark Plug Co., Ltd.(assignment on the face of the patent)
Jul 01 2003OKUGAWA, KEISUKENGK SPARK PLUG CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0145080224 pdf
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