Patent
   D578536
Priority
Aug 27 2007
Filed
Feb 27 2008
Issued
Oct 14 2008
Expiry
Oct 14 2022
Assg.orig
Entity
unknown
23
73
n/a
The ornamental design for a chip, as shown and described.

FIG. 1 is a perspective view of a new chip design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lei, Leo, Wang, Raymond

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Feb 27 2008Podium Photonics (Guangzhou) Ltd.(assignment on the face of the patent)
Feb 27 2008LEI, LEOPODIUM PHOTONICS GUANGZHOU LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0205760508 pdf
Feb 27 2008WANG, RAYMONDPODIUM PHOTONICS GUANGZHOU LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0205760508 pdf
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