Patent
   D618630
Priority
Mar 24 2009
Filed
May 30 2009
Issued
Jun 29 2010
Expiry
Jun 29 2024
Assg.orig
Entity
unknown
15
10
n/a
The ornamental design for a heat dissipation apparatus, as shown.

FIG. 1 is a perspective view of a heat dissipation apparatus showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Jiang, Wen-Jang, Wei, Tien-Ho, Chen, Yung-I

Patent Priority Assignee Title
10284268, Feb 23 2015 UBIQUITI INC Radio apparatuses for long-range communication of radio-frequency information
10381739, Oct 09 2015 UBIQUITI INC Synchronized multiple-radio antenna systems and methods
10680342, Oct 09 2015 UBIQUITI INC Synchronized multiple-radio antenna systems and methods
10749581, Feb 23 2015 UBIQUITI INC Radio apparatuses for long-range communication of radio-frequency information
10770787, Oct 14 2014 UBIQUITI INC Multi-sector antennas
10916844, Mar 17 2014 UBIQUITI INC Array antennas having a plurality of directional beams
11115089, Feb 23 2015 Ubiquiti Inc. Radio apparatuses for long-range communication of radio-frequency information
11296407, Mar 17 2014 Ubiqsiti Inc. Array antennas having a plurality of directional beams
11303016, Oct 14 2014 Ubiquiti Inc. Multi-sector antennas
11303037, Oct 09 2015 Ubiquiti Inc. Synchronized multiple-radio antenna systems and meihods
11336342, Feb 23 2015 Ubiquiti Inc. Radio apparatuses for long-range communication of radio-frequency information
11973271, Oct 09 2015 Ubiquiti Inc. Synchronized multiple-radio antenna systems and methods
D650339, Apr 02 2010 Foxsemicon Integrated Technology, Inc Illumination device
D681866, Jul 23 2012 Foxsemicon Integrated Technology, Inc. LED lamp cover
D840958, Nov 15 2016 Borgwamer Emissions Systems Spain, S.L.U. Shaped tube with a pattern
Patent Priority Assignee Title
4899210, Jan 20 1988 WAKEFIELD THERMAL SOLUTIONS, INC Heat sink
6025643, Jul 29 1998 Device for dissipating heat from a semiconductor element
6736204, Dec 06 2001 ERK ECKROHRKESSEL GMBH Heat transfer surface with a microstructure of projections galvanized onto it
6975511, Jul 18 2002 Rockwell Collins; Rockwell Collins, Inc Ruggedized electronic module cooling system
7371965, May 09 2002 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC Modular cage with heat sink for use with pluggable module
7529094, Apr 28 2006 TE Connectivity Solutions GmbH Integrated heat sink and light pipe mounting assembly
7539018, Oct 31 2007 TE Connectivity Solutions GmbH Heat sink retaining clip for an electrical connector assembly
7593230, May 05 2005 GLT ACQUISITION CORP Apparatus for absorbing and dissipating excess heat generated by a system
20080066888,
D471168, Jan 07 2002 TELTRONICS INTERNATIONAL, INC Heat dissipating RF electronics housing
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
May 20 2009WEI, TIEN-HOFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0227560730 pdf
May 20 2009CHEN, YUNG-IFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0227560730 pdf
May 20 2009JIANG, WEN-JANGFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0227560730 pdf
May 30 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule