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The ornamental design for a heat dissipating RF electronics housing, as shown and described.
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FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.
FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.
FIG. 3 is a top photographic view of the housing according to FIG. 1.
FIG. 4 is a side photographic view of the housing according to FIG. 1.
FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.
FIG. 6 is an end view of the housing according to FIG. 5; and,
FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1.
Ge, David, Jamal, Mohammed Nusrat
| Patent | Priority | Assignee | Title |
| D519980, | Nov 09 2001 | Milwaukee Electric Tool Corporation | Base portion for a radio |
| D618630, | Mar 24 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D621796, | Aug 14 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D621797, | Sep 11 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D622227, | Sep 11 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D622228, | Sep 11 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D622229, | Nov 09 2009 | Foxsemicon Integrated Technology, Inc. | Illumination device |
| D622230, | Nov 02 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D627746, | Dec 25 2009 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
| D634720, | Oct 13 2009 | Askey Computer Corp. | Housing for communication equipment |
| D635106, | Oct 13 2009 | Askey Computer Corp. | Housing for communication equipment |
| D758301, | Mar 29 2013 | GS Yuasa International Ltd.; KOBELCO CONSTRUCTION MACHINERY CO., LTD. | Rechargeable battery |
| D927435, | Apr 12 2019 | SHIN-ETSU POLYMER CO , LTD ; Daimler AG | Heat dissipating device for batteries or electric devices |
| Patent | Priority | Assignee | Title |
| 4541004, | Nov 24 1982 | Unisys Corporation | Aerodynamically enhanced heat sink |
| 5358032, | Feb 05 1992 | Renesas Electronics Corporation | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
| 5509465, | Mar 10 1995 | LAI, YAW-HUEY | Heat-dissipating device for a central processing unit chip |
| 5581442, | Jun 06 1995 | WAKEFIELD THERMAL SOLUTIONS, INC | Spring clip for clamping a heat sink module to an electronic module |
| 5862038, | Aug 27 1996 | Fujitsu Limited | Cooling device for mounting module |
| 5964285, | Feb 12 1999 | Yung-Tsai Chu | Heat sink |
| 6055159, | Aug 20 1999 | Compal Electronics, Inc. | Heat dissipating module for a heat generating electronic component |
| 6295202, | Jun 29 2000 | Hewlett-Packard Company | Heatsink for actively cooled daughterboard system |
| D387333, | Sep 25 1995 | Curtis Instruments, Inc. | Heatsink enclosure for an electrical controller |
| D423502, | Feb 22 1999 | Heat dissipating audio amplifier housing with LED window |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 07 2002 | Teletronics International | (assignment on the face of the patent) | / | |||
| Mar 28 2002 | GE, DAVID | TELTRONICS INTERNATIONAL, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012756 | /0397 | |
| Mar 28 2002 | JAMAL, MOHAMMED NUSRAT | TELTRONICS INTERNATIONAL, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012756 | /0397 |
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