Illumination device

The ornamental design for an illumination device, as shown.

FIG. 1 is a perspective view of an illumination device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Patent	Priority	Assignee	Title
D645984,	Sep 02 2010	Ceramate Technical Co., Ltd.	LED light
D650339,	Apr 02 2010	Foxsemicon Integrated Technology, Inc	Illumination device
D672729,	Dec 30 2011	Foxsemicon Integrated Technology, Inc.	Heat sink
D673124,	Dec 28 2011	Foxsemicon Integrated Technology, Inc.	Heat sink
D681866,	Jul 23 2012	Foxsemicon Integrated Technology, Inc.	LED lamp cover

Patent	Priority	Assignee	Title
4899210,	Jan 20 1988	WAKEFIELD THERMAL SOLUTIONS, INC	Heat sink
6025643,	Jul 29 1998		Device for dissipating heat from a semiconductor element
6736204,	Dec 06 2001	ERK ECKROHRKESSEL GMBH	Heat transfer surface with a microstructure of projections galvanized onto it
6975511,	Jul 18 2002	Rockwell Collins; Rockwell Collins, Inc	Ruggedized electronic module cooling system
7371965,	May 09 2002	II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC	Modular cage with heat sink for use with pluggable module
7529094,	Apr 28 2006	TE Connectivity Solutions GmbH	Integrated heat sink and light pipe mounting assembly
7539018,	Oct 31 2007	TE Connectivity Solutions GmbH	Heat sink retaining clip for an electrical connector assembly
7593230,	May 05 2005	GLT ACQUISITION CORP	Apparatus for absorbing and dissipating excess heat generated by a system
20080066888,
D471168,	Jan 07 2002	TELTRONICS INTERNATIONAL, INC	Heat dissipating RF electronics housing

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Nov 20 2009	YAN, RONG-YIH	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	023653	0062	pdf
Nov 20 2009	YANG, HONG-BIN	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	023653	0062	pdf
Dec 15 2009		Foxsemicon Integrated Technology, Inc.	(assignment on the face of the patent)

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