Patent
   D673124
Priority
Dec 28 2011
Filed
Dec 28 2011
Issued
Dec 25 2012
Expiry
Dec 25 2026
Assg.orig
Entity
unknown
5
15
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of a heat sink of my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line showing of the heat sink is for illustrative purposes only and forms no part of the claimed design.

Lin, Chu-Keng

Patent Priority Assignee Title
11204204, Mar 08 2019 Toyota Jidosha Kabushiki Kaisha Acoustic absorber with integrated heat sink
D827589, Apr 05 2016 SUMITOMO SEIKA CHEMICALS CO , LTD Heat sink
D880436, Nov 15 2018 RB Distribution, Inc. Heat sink for a control module
D942403, Oct 24 2019 WOLFSPEED, INC Power module having pin fins
D985517, Oct 24 2019 WOLFSPEED, INC Power module having pin fins
Patent Priority Assignee Title
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Dec 20 2011LIN, CHU-KENGFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0274490267 pdf
Dec 28 2011Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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