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Patent
D621796
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Priority
Aug 14 2009
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Filed
Nov 04 2009
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Issued
Aug 17 2010
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Expiry
Aug 17 2024
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Assg.orig
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Entity
unknown
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15
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10
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n/a
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The ornamental design for a heat dissipation apparatus, as shown.
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FIG. 1 is a perspective view of a heat dissipation apparatus in one operational state.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Hu, Chi-Chung, Huang, Zheng-Jay, Yan, Rong-Yih
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| D650339, |
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| D672729, |
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| D673124, |
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| D681866, |
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| Patent |
Priority |
Assignee |
Title |
| 4899210, |
Jan 20 1988 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
| 6025643, |
Jul 29 1998 |
|
Device for dissipating heat from a semiconductor element |
| 6736204, |
Dec 06 2001 |
ERK ECKROHRKESSEL GMBH |
Heat transfer surface with a microstructure of projections galvanized onto it |
| 6975511, |
Jul 18 2002 |
Rockwell Collins; Rockwell Collins, Inc |
Ruggedized electronic module cooling system |
| 7371965, |
May 09 2002 |
II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC |
Modular cage with heat sink for use with pluggable module |
| 7529094, |
Apr 28 2006 |
TE Connectivity Solutions GmbH |
Integrated heat sink and light pipe mounting assembly |
| 7539018, |
Oct 31 2007 |
TE Connectivity Solutions GmbH |
Heat sink retaining clip for an electrical connector assembly |
| 7593230, |
May 05 2005 |
GLT ACQUISITION CORP |
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| 20080066888, |
|
|
|
| D471168, |
Jan 07 2002 |
TELTRONICS INTERNATIONAL, INC |
Heat dissipating RF electronics housing |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a