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Patent
   D650339
Priority
Apr 02 2010
Filed
Apr 02 2010
Issued
Dec 13 2011
Expiry
Dec 13 2025

TERM.DISCL.
Inventors
Yang, Hong…
Assg.orig
Foxsemicon…
Assg.curr
Foxsemicon…
Entity
unknown
Referenced by
8
References
16
Maint.:
n/a
The ornamental design for an illumination device, as shown.

FIG. 1 is a perspective view of an illumination device of our new design.

FIG. 2 is a front elevational view thereof

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.
INVENTORS:

Yang, Hong-Bin, Tsai, Ping-Jung, Liu, Yu-Pin, Chang, Chih-Hao, Wu, Yu-Chia

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
11859915, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D786458, Aug 07 2014 EPISTAR CORPORATION Light emitting diode filament
D856945, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D896767, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D969760, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D986083, Dec 27 2019 Fourstar Group Inc. Illumination display
ER7532,
ER9788,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
4899210, Jan 20 1988 WAKEFIELD THERMAL SOLUTIONS, INC Heat sink
6025643, Jul 29 1998 Device for dissipating heat from a semiconductor element
6736204, Dec 06 2001 ERK ECKROHRKESSEL GMBH Heat transfer surface with a microstructure of projections galvanized onto it
6975511, Jul 18 2002 Rockwell Collins; Rockwell Collins, Inc Ruggedized electronic module cooling system
7371965, May 09 2002 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC Modular cage with heat sink for use with pluggable module
7529094, Apr 28 2006 TE Connectivity Solutions GmbH Integrated heat sink and light pipe mounting assembly
7539018, Oct 31 2007 TE Connectivity Solutions GmbH Heat sink retaining clip for an electrical connector assembly
7593230, May 05 2005 GLT ACQUISITION CORP Apparatus for absorbing and dissipating excess heat generated by a system
20080066888,
D618630, Mar 24 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
D621796, Aug 14 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
D621797, Sep 11 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
D622227, Sep 11 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
D622228, Sep 11 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
D622229, Nov 09 2009 Foxsemicon Integrated Technology, Inc. Illumination device
D622230, Nov 02 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
ASSIGNMENT RECORDS    Assignment records on the USPTO
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 29 2010CHANG, CHIH-HAOFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241780052 pdf
Mar 29 2010TSAI, PING-JUNG Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241780052 pdf
Mar 29 2010WU, YU-CHIA Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241780052 pdf
Mar 29 2010LIU, YU-PIN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241780052 pdf
Mar 29 2010YANG, HONG-BIN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0241780052 pdf
Apr 02 2010Foxsemicon Integrated Technology, Inc(assignment on the face of the patent)
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