Patent
   D627746
Priority
Dec 25 2009
Filed
Dec 31 2009
Issued
Nov 23 2010
Expiry
Nov 23 2024

TERM.DISCL.
Assg.orig
Entity
unknown
4
10
n/a
The ornamental design for a heat dissipation apparatus, as shown and described.

FIG. 1 is a perspective view of a heat dissipation apparatus.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Yan, Rong-Yih, Yang, Hong-Bin

Patent Priority Assignee Title
D672729, Dec 30 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D673124, Dec 28 2011 Foxsemicon Integrated Technology, Inc. Heat sink
D942403, Oct 24 2019 WOLFSPEED, INC Power module having pin fins
D985517, Oct 24 2019 WOLFSPEED, INC Power module having pin fins
Patent Priority Assignee Title
4899210, Jan 20 1988 WAKEFIELD THERMAL SOLUTIONS, INC Heat sink
6025643, Jul 29 1998 Device for dissipating heat from a semiconductor element
6736204, Dec 06 2001 ERK ECKROHRKESSEL GMBH Heat transfer surface with a microstructure of projections galvanized onto it
6975511, Jul 18 2002 Rockwell Collins; Rockwell Collins, Inc Ruggedized electronic module cooling system
7371965, May 09 2002 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC Modular cage with heat sink for use with pluggable module
7529094, Apr 28 2006 TE Connectivity Solutions GmbH Integrated heat sink and light pipe mounting assembly
7539018, Oct 31 2007 TE Connectivity Solutions GmbH Heat sink retaining clip for an electrical connector assembly
7593230, May 05 2005 GLT ACQUISITION CORP Apparatus for absorbing and dissipating excess heat generated by a system
20080066888,
D471168, Jan 07 2002 TELTRONICS INTERNATIONAL, INC Heat dissipating RF electronics housing
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 01 2009YAN, RONG-YIH Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0237230475 pdf
Dec 01 2009YANG, HONG-BIN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0237230475 pdf
Dec 31 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule