Patent
   D926715
Priority
Jul 29 2019
Filed
Nov 12 2019
Issued
Aug 03 2021
Expiry
Aug 03 2036
Assg.orig
Entity
unknown
6
14
n/a
The ornamental design for a support for a wafer for fabricating a semiconductor, as shown and described.

FIG. 1 is a front view of a support for a wafer for fabricating a semiconductor showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top perspective view thereof; and,

FIG. 8 is a bottom perspective view thereof.

Okabe, Akira, Takenaga, Yukio

Patent Priority Assignee Title
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Nov 05 2019OKABE, AKIRAEPICREW CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0510470797 pdf
Nov 05 2019TAKENAGA, YUKIOEPICREW CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0510470797 pdf
Nov 12 2019EPICREW CORPORATION(assignment on the face of the patent)
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