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Patent
D924953
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Priority
Jul 19 2018
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Filed
Dec 04 2018
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Issued
Jul 13 2021
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Expiry
Jul 13 2036
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Assg.orig
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Entity
unknown
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3
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15
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n/a
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I claim the ornamental design for a gas inlet attachment for substrate processing apparatus, as shown and described.
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FIG. 1 is a front, top and left side perspective view of a gas inlet attachment for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof; and,
FIG. 4 is a left side elevational view thereof;
FIG, 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view take along line 8-8 in Fig.4.
Shimada, Hironori
Patent |
Priority |
Assignee |
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Substrate processing apparatus having gas side flow via gas inlet |
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D326272, |
Jul 25 1988 |
Tel Sagami Limited |
Heat insulating cylinder for thermal treatment of semiconductor wafers |
D890572, |
Jul 19 2018 |
KOKUSAI ELECTRIC CORPORATION |
Gas supply nozzle for substrate processing apparatus |
D901564, |
Jan 28 2019 |
KOKUSAI ELECTRIC CORPORATION |
Gas inlet attachment for wafer processing apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a