Patent
   D924953
Priority
Jul 19 2018
Filed
Dec 04 2018
Issued
Jul 13 2021
Expiry
Jul 13 2036
Assg.orig
Entity
unknown
3
15
n/a
I claim the ornamental design for a gas inlet attachment for substrate processing apparatus, as shown and described.

FIG. 1 is a front, top and left side perspective view of a gas inlet attachment for substrate processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof; and,

FIG. 4 is a left side elevational view thereof;

FIG, 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view take along line 8-8 in Fig.4.

Shimada, Hironori

Patent Priority Assignee Title
D944661, Jul 17 2019 KOKUSAI ELECTRIC CORPORATION Calibrator for wafer handling robots
D964443, Aug 18 2020 KOKUSAI ELECTRIC CORPORATION Gas inlet attachment for wafer processing apparatus
ER4299,
Patent Priority Assignee Title
7700054, Dec 12 2006 KOKUSAI ELECTRIC CORPORATION Substrate processing apparatus having gas side flow via gas inlet
20030159653,
20080302302,
20130220221,
20130276707,
20140239091,
20150240359,
20170051408,
20170073810,
20170241015,
20170283947,
20180087156,
D326272, Jul 25 1988 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
D890572, Jul 19 2018 KOKUSAI ELECTRIC CORPORATION Gas supply nozzle for substrate processing apparatus
D901564, Jan 28 2019 KOKUSAI ELECTRIC CORPORATION Gas inlet attachment for wafer processing apparatus
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 14 2018SHIMADA, HIRONORIKOKUSAI ELECTRIC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0476660018 pdf
Dec 04 2018KOKUSAI ELECTRIC CORPORATION(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule