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Patent
D901564
Priority
Jan 28 2019
Filed
Jul 26 2019
Issued
Nov 10 2020
Expiry
Nov 10 2035
Assg.orig
Entity
unknown
7
17
n/a
The ornamental design for a gas inlet attachment for wafer processing apparatus, as shown and described.
FIG. 1 is a front, top and right side perspective view of a gas inlet attachment for wafer processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8 -8 in FIG. 2 .
Morita, Shinya , Murata, Satoru
Patent
Priority
Assignee
Title
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Aug 25 2016
ASM IP Holding B.V.; ASM IP HOLDING B V
Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line
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Tel Sagami Limited
Heat insulating cylinder for thermal treatment of semiconductor wafers
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TEL SAGAMI LIMITED A CORPORATION OF JAPAN
Heat insulating cylinder for thermal treatment of semiconductor wafers
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Nov 18 2015
ASM IP Holding B.V.
Gas supply plate for semiconductor manufacturing apparatus
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Jan 08 2016
ASM IP Holding B.V.
Gas flow control plate for semiconductor manufacturing apparatus
Date
Maintenance Fee Events
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Maintenance Schedule
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