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The ornamental design for a gas ring for a plasma processing apparatus, as shown and described.
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/635,287, filed herewith and entitled “Electrode Plate for a Plasma Processing Apparatus”;
Application Ser. No. 29/635,292, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”; and
Application Ser. No. 29/635,296, filed herewith and entitled “Electrode Plate Peripheral Ring for a Plasma Processing Apparatus”.
The broken lines in
Okuda, Kouji, Tanaka, Motohiro
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 30 2018 | Hitachi High-Technologies Corporation | (assignment on the face of the patent) | / | |||
Jun 25 2018 | OKUDA, KOUJI | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046509 | /0546 | |
Jun 25 2018 | TANAKA, MOTOHIRO | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046509 | /0546 | |
Feb 12 2020 | Hitachi High-Technologies Corporation | HITACHI HIGH-TECH CORPORATION | CHANGE OF NAME AND ADDRESS | 052259 | /0227 |
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