FIG. 1 is a front, top and right side perspective view of an ion shield plate base for semiconductor manufacturing apparatus, showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 7;
FIG. 10 is an enlarged view of the portion shown in box, labeled, “FIG. 10,” in FIG. 9; and,
FIG. 11 is an enlarged view of the portion shown in box, labeled, “FIG. 11,” in FIG. 9.
The broken line boxes shown in FIG. 9 define the enlarged portion views shown in FIGS. 10 and 11 and form no part of the claimed design.
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