FIG. 1 is a front and rear (the pin is symmetric front to back) plan view of the tip with the remaining portion of the pin shown in broken lines.
FIG. 2 is a front/side perspective view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a side plan view thereof.
FIG. 5 is the other side view thereof.
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a bottom front perspective view thereof.
FIG. 8 is a bottom rear perspective view thereof.
FIG. 9 is rear plan view thereof.
FIG. 10 is a rear perspective view thereof.
FIG. 11 is a top front perspective partial view of the tip portion only.
FIG. 12 is a front plan view of an alternate embodiment thereof.
FIG. 13 is a perspective view of an alternate embodiment thereof.
FIG. 14 is top plan view of an alternate embodiment thereof.
FIG. 15 is a side plan view of an alternate embodiment thereof.
FIG. 16 is the other side plan view of an alternate embodiment thereof.
FIG. 17 is a bottom plan view of an alternate embodiment thereof.
FIG. 18 is a front perspective view of an alternate embodiment thereof.
FIG. 19 is a bottom perspective view of an alternate embodiment of the other side thereof.
FIG. 20 is a close up partial top perspective view of the alternate embodiment thereof.
FIG. 21 is a front plan view thereof; and,
FIG. 22 is a bottom perspective view thereof.
The features shown in broken line depict environmental subject matter only and form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
5230632, |
Dec 19 1991 |
International Business Machines Corporation |
Dual element electrical contact and connector assembly utilizing same |
5812378, |
Jun 07 1994 |
Tessera, Inc. |
Microelectronic connector for engaging bump leads |
6246249, |
Mar 19 1997 |
Fujitsu Limited |
Semiconductor inspection apparatus and inspection method using the apparatus |
7445465, |
Jul 08 2005 |
Johnstech International Corporation |
Test socket |
7639026, |
Feb 24 2006 |
Johnstech International Corporation |
Electronic device test set and contact used therein |
7737708, |
May 11 2006 |
Johnstech International Corporation |
Contact for use in testing integrated circuits |
9007082, |
Sep 07 2010 |
Johnstech International Corporation |
Electrically conductive pins for microcircuit tester |
9261537, |
Jun 20 2012 |
Johnstech International Corporation |
Wafer level integrated circuit contactor and method of construction |
9817026, |
Jun 20 2012 |
Johnstech International Corporation |
Wafer level integrated circuit contactor and method of construction |
9958499, |
Jul 07 2015 |
Johnstech International Corporation |
Constant stress pin tip for testing integrated circuit chips |
20010011907, |
|
|
|
20030192181, |
|
|
|
20040201390, |
|
|
|
20070202714, |
|
|
|
D444401, |
Jul 31 2000 |
TELEDYNE LECROY, INC |
Electrical test probe wedge tip |
D444720, |
Jul 31 2000 |
TELEDYNE LECROY, INC |
Notched electrical test probe tip |
D711836, |
Jul 10 2013 |
Johnstech International Corporation |
Articulating contact pin |
D719923, |
May 15 2014 |
Johnstech International Corporation |
Articulating contact pin |
D727269, |
Jan 29 2014 |
Johnstech International Corporation |
Articulating contact pin |
D749525, |
Jan 29 2014 |
Johnstech International Corporation |
Articulating contact pin |
D749526, |
Jan 29 2014 |
Johnstech International Corporation |
Articulating contact pin |
D769747, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D769748, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D769749, |
Dec 19 2014 |
Omron Corporation |
Probe pin |
D769750, |
Sep 15 2015 |
Omron Corporation |
Probe pin |
D769751, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D769752, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D775984, |
Mar 04 2015 |
Omron Corporation |
Probe pin |
D776551, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D776552, |
Dec 15 2014 |
Omron Corporation |
Probe pin |
D788615, |
Feb 15 2016 |
Omron Corporation |
Probe pin |
D788616, |
Feb 15 2016 |
Omron Corporation |
Probe pin |