Patent
   D711331
Priority
Nov 07 2013
Filed
Nov 07 2013
Issued
Aug 19 2014
Expiry
Aug 19 2028
Assg.orig
Entity
unknown
9
22
n/a
The ornamental design for an upper chamber liner, as shown and described.

FIG. 1 is a top perspective view of an upper chamber liner showing our new design;

FIG. 2 is another top perspective view thereof;

FIG. 3 is a bottom perspective view thereof;

FIG. 4 is another bottom perspective view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a side view thereof;

FIG. 8 is another side view thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5;

FIG. 10 is an enlarged top view of the upper portion of FIG. 9; and,

FIG. 11 is an enlarged bottom view of the lower portion of FIG. 9.

The broken lines in the figures form no part of the claimed design.

The upper chamber liner is shown broken away in FIGS. 10 and 11 to indicate that no particular length is claimed.

All surfaces not shown, form no part of the claimed design.

Chang, Anzhong, Brillhart, Paul, Samir, Mehmet Tugrul, Lau, Shu-Kwan, Collins, Richard O.

Patent Priority Assignee Title
D736261, Nov 29 2012 Cummins Inc Shroud
D741823, Jul 10 2013 KOKUSAI ELECTRIC CORPORATION Vaporizer for substrate processing apparatus
D875053, Apr 28 2017 Applied Materials, Inc Plasma connector liner
D875054, Apr 28 2017 Applied Materials, Inc Plasma connector liner
D875055, Apr 28 2017 Applied Materials, Inc Plasma connector liner
D910400, Sep 04 2019 YONGKANG MOYI TOOLS CO , LTD Grinder dust shroud
D913979, Aug 28 2019 Applied Materials, Inc Inner shield for a substrate processing chamber
D925481, Dec 06 2018 KOKUSAI ELECTRIC CORPORATION Inlet liner for substrate processing apparatus
ER1483,
Patent Priority Assignee Title
6099651, Sep 11 1997 Applied Materials, Inc. Temperature controlled chamber liner
6170429, Sep 30 1998 Lam Research Corporation Chamber liner for semiconductor process chambers
6234219, May 25 1999 Micron Technology, Inc. Liner for use in processing chamber
7066107, Aug 28 2001 HYNIX SEMICONDUCTOR MANUFACTURING AMERICA INC ; HYUNDAI SEMICONDUCTOR AMERICA, INC Shielding system for plasma chamber
8617672, Jul 13 2005 Applied Materials, Inc Localized surface annealing of components for substrate processing chambers
20070113783,
D404370, Aug 20 1997 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
D404372, Aug 20 1997 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
D556704, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Grounded electrode for a plasma processing apparatus
D557226, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D593969, Oct 10 2006 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
D599827, May 07 2008 Komatsu Ltd Fan shroud for construction machinery
D600722, May 07 2008 Komatsu Ltd Fan shroud for construction machinery
D605206, May 07 2008 Komatsu Ltd Fan shroud for construction machinery
D620031, May 07 2008 Komatsu Ltd Fan shroud for construction machinery
D655258, Oct 21 2010 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
D655262, Oct 21 2010 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
D658691, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D658692, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D658693, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D694790, Sep 20 2011 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
D697038, Sep 20 2011 Tokyo Electron Limited Baffle plate
//////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 07 2013Applied Materials, Inc.(assignment on the face of the patent)
Nov 13 2013BRILLHART, PAULApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316840703 pdf
Nov 14 2013LAU, SHU-KWANApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316840703 pdf
Nov 14 2013SAMIR, MEHMET TUGRULApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316840703 pdf
Nov 14 2013CHANG, ANZHONGApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316840703 pdf
Nov 18 2013COLLINS, RICHARD O Applied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316840703 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule