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Patent
D711331
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Priority
Nov 07 2013
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Filed
Nov 07 2013
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Issued
Aug 19 2014
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Expiry
Aug 19 2028
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Assg.orig
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Entity
unknown
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9
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22
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n/a
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The ornamental design for an upper chamber liner, as shown and described.
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FIG. 1 is a top perspective view of an upper chamber liner showing our new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is another bottom perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5;
FIG. 10 is an enlarged top view of the upper portion of FIG. 9; and,
FIG. 11 is an enlarged bottom view of the lower portion of FIG. 9.
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 10 and 11 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.
Chang, Anzhong, Brillhart, Paul, Samir, Mehmet Tugrul, Lau, Shu-Kwan, Collins, Richard O.
Patent |
Priority |
Assignee |
Title |
D736261, |
Nov 29 2012 |
Cummins Inc |
Shroud |
D741823, |
Jul 10 2013 |
KOKUSAI ELECTRIC CORPORATION |
Vaporizer for substrate processing apparatus |
D875053, |
Apr 28 2017 |
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D875054, |
Apr 28 2017 |
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Plasma connector liner |
D875055, |
Apr 28 2017 |
Applied Materials, Inc |
Plasma connector liner |
D910400, |
Sep 04 2019 |
YONGKANG MOYI TOOLS CO , LTD |
Grinder dust shroud |
D913979, |
Aug 28 2019 |
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Inner shield for a substrate processing chamber |
D925481, |
Dec 06 2018 |
KOKUSAI ELECTRIC CORPORATION |
Inlet liner for substrate processing apparatus |
ER1483, |
|
|
|
Patent |
Priority |
Assignee |
Title |
6099651, |
Sep 11 1997 |
Applied Materials, Inc. |
Temperature controlled chamber liner |
6170429, |
Sep 30 1998 |
Lam Research Corporation |
Chamber liner for semiconductor process chambers |
6234219, |
May 25 1999 |
Micron Technology, Inc. |
Liner for use in processing chamber |
7066107, |
Aug 28 2001 |
HYNIX SEMICONDUCTOR MANUFACTURING AMERICA INC ; HYUNDAI SEMICONDUCTOR AMERICA, INC |
Shielding system for plasma chamber |
8617672, |
Jul 13 2005 |
Applied Materials, Inc |
Localized surface annealing of components for substrate processing chambers |
20070113783, |
|
|
|
D404370, |
Aug 20 1997 |
Tokyo Electron Limited |
Cap for use in a semiconductor wafer heat processing apparatus |
D404372, |
Aug 20 1997 |
Tokyo Electron Limited |
Ring for use in a semiconductor wafer heat processing apparatus |
D556704, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D557226, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D593969, |
Oct 10 2006 |
Tokyo Electron Limited |
Processing chamber for manufacturing semiconductors |
D599827, |
May 07 2008 |
Komatsu Ltd |
Fan shroud for construction machinery |
D600722, |
May 07 2008 |
Komatsu Ltd |
Fan shroud for construction machinery |
D605206, |
May 07 2008 |
Komatsu Ltd |
Fan shroud for construction machinery |
D620031, |
May 07 2008 |
Komatsu Ltd |
Fan shroud for construction machinery |
D655258, |
Oct 21 2010 |
Tokyo Electron Limited |
Side wall for reactor for manufacturing semiconductor |
D655262, |
Oct 21 2010 |
Tokyo Electron Limited |
Side wall for reactor for manufacturing semiconductor |
D658691, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D658692, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D658693, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D694790, |
Sep 20 2011 |
Tokyo Electron Limited |
Baffle plate for manufacturing semiconductor |
D697038, |
Sep 20 2011 |
Tokyo Electron Limited |
Baffle plate |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 07 2013 | | Applied Materials, Inc. | (assignment on the face of the patent) | | / |
Nov 13 2013 | BRILLHART, PAUL | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031684 | /0703 |
pdf |
Nov 14 2013 | LAU, SHU-KWAN | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031684 | /0703 |
pdf |
Nov 14 2013 | SAMIR, MEHMET TUGRUL | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031684 | /0703 |
pdf |
Nov 14 2013 | CHANG, ANZHONG | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031684 | /0703 |
pdf |
Nov 18 2013 | COLLINS, RICHARD O | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031684 | /0703 |
pdf |
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